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2 edition of Stress-induced phenomena in metallization found in the catalog.

Stress-induced phenomena in metallization

International Workshop on Stress-Induced Phenomena in Metallization (10th 2008 Austin, Texas)

Stress-induced phenomena in metallization

Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 5-7 November 2008

by International Workshop on Stress-Induced Phenomena in Metallization (10th 2008 Austin, Texas)

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Published by American Institute of Physics in Melville, N.Y .
Written in English

    Subjects:
  • Copper,
  • Metal-metal bonds,
  • Strength of materials,
  • Semiconductors,
  • Nanostructured materials,
  • Congresses,
  • Defects,
  • Electric properties,
  • Interconnects (Integrated circuit technology)

  • Edition Notes

    Includes bibliographical references and index.

    Other titlesTenth International Workshop on Stress-Induced Phenomena in Metallization, International Workshop on Stress-Induced Phenomena in Metallization
    Statementeditors, Paul S. Ho, Shinichi Ogawa, Ehrenfried Zschech ; sponsoring organization, the University of Texas at Austin
    SeriesAIP conference proceedings -- v. 1143, AIP conference proceedings -- no. 1143.
    ContributionsHo, P. S., Ogawa, Shinichi, Dr, Zschech, Ehrenfried
    Classifications
    LC ClassificationsTK7871.85 .I58445 2008
    The Physical Object
    Paginationvii, 233 p. :
    Number of Pages233
    ID Numbers
    Open LibraryOL25147337M
    ISBN 100735406804
    ISBN 109780735406803
    LC Control Number2009928111
    OCLC/WorldCa426030732

    Measurement of Stresses in Thin Films and Their Relaxation. “High resolution microdiffraction studies using synchrotron radiation,” 6th International Workshop on Stress-Induced Phenomena in Metallization, Gao H. () Measurement of Stresses in Thin Films and Their Relaxation. In: Gupta D. (eds) Diffusion Processes in Advanced Author: Oliver Kraft, Huajian Gao. CP, Stress-Induced Phenomena in Metallization: Sixth International Workshop, edited by S. P. Baker, M. A. Korhonen, E. Arzt, and P. S. Ho, pp.

    Trove: Find and get Australian resources. Books, images, historic newspapers, maps, archives and more. May 22,  · Gan Z H, Shao W, Mhaisalkar S G, Chen Z and Gusak A Stress-Induced Phenomena in Metallization: 8th Int. Workshop (New York: AIP) pp [44] Tan C M, Roy A, Vairagar A V, Krishnamoorthy A and Mhaisalkar S G Current crowding effect on copper dual damascene via bottom failure for ULSI applications IEEE Trans. Device consumersnewhomeconstruction.com: Cher Ming Tan.

    Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization, vol. , AIP, Austin, TX (), pp. Google Scholar [9]Cited by: Stress-induced phenomena in metallization. Eleventh International Workshop on Stress-Induced Phenomena in Metallization PrefaceAuthor: E. Zschech, P. Ho and S. Ogawa.


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Stress-induced phenomena in metallization by International Workshop on Stress-Induced Phenomena in Metallization (10th 2008 Austin, Texas) Download PDF EPUB FB2

A volume taken from papers presented at the Workshop on Stress Induced Phenomena in Metallization. This conference has been extended to reflect interest in interconnect metallization. First, the topics in metallization were extended to include problems related to atomic transport for reflow and filling of vias and contact holes, silicadation, and barrier consumersnewhomeconstruction.com: $ Stress Induced Phenomena in Metallization: Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York, July Stress-Induced Phenomena Metallizat.) [Shefford P.

Baker, Matti A. Korhonen, Eduard Arzt, Paul S. Ho] on consumersnewhomeconstruction.com *FREE* shipping on qualifying offers. Tiny metal structures, less than a millionth of a meter across, are critical building Author: Shefford P.

Baker. Stress-Induced Phenomena Metallizat.) [Paul S. Ho, Shefford P. Baker, Tomoji Nakamura, Cynthia A.

Volkert] on consumersnewhomeconstruction.com *FREE* shipping on qualifying offers. These proceedings contain new research results and advances in basic understanding of stress-induced phenomena in consumersnewhomeconstruction.com: Paul S.

consumersnewhomeconstruction.com: Stress-induced Phenomena in Metallization: Proceedings of the Second International Workshop held in Austin, Texas, March (AIP Conference Stress-Induced Phenomena Metallizat.) (): P.S.

Ho, C.Y. Li: Books. Stress induced Phenomena in Metallization: Fifth International Workshop: Stuttgart, Germany, June(AIP Conference Proceedings / AIP Phenomena Metallizat.) [Oliver Kraft, Eduard Arzt, Cynthia A.

Volkert, Paul S. Ho, Hidekazu Okabayashi] on consumersnewhomeconstruction.com *FREE* shipping on qualifying offers. The performance of computer chips has been improved by reducing the size of all components. Title: Stress-Induced Phenomena in Metallization: Authors: Ho, Paul S.; Zschech, Ehrenfried; Ogawa, Shinichi Publication: Stress-Induced Phenomena in Metallization.

These proceedings represent papers presented at the Second International Workshop on Stress Induced Phenomena in Metallization held on Marchat the University of Texas at Austin, U.S.A.

The papers included in this volume discuss stress-induced void formation and electromigration failures in narrow-line inter-connect metallization.

Fishpond Indonesia, Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization by Sun-Chan Jeong (Edited) Yutaka Utsuno (Edited)Buy. Books online: Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization,consumersnewhomeconstruction.comd: American Institute of Physics.

Preface: Stress-Induced Phenomena and Reliability in 3D Microelectronics This volume of proceedings contains papers from three International Workshops “Stress Management for 3D ICs using Through. Stress-Induced Phenomena in Metallization: Seventh International Workshop on Stress-Induced Phenomena in Metallization held June, in Austin, Texas.

Edited by Paul S. Ho, Shefford P. Baker, Tomoji Nakamura, and Cynthia A. Volkert. Abstract. Thermal stresses in metallizations are of current concern in the microelectronics industry. Stress-induced void and hillock formation are the main causes of interconnect failure before service.

1–4 Recently there has been a growing concern that stress-induced voids in the interconnect lines, formed during fabrication, may enhance subsequent electromigration damage during the use of Cited by: 3. 11th International Workshop on Stress-Induced Phenomena in Metallization April 12 - 14, in Dresden, Germany.

Some impressions. Stress Induced Phenomena in Metallization: Sixth International Workshop on Stress, held July, in Ithaca, NY. Edited by Shefford P. Baker, Matti A. Korhonen, Eduard Arzt, and Paul S. AIP Conference Proceedings, Vol.(AIPC Homepage) Publication Date.

The aim of this text of stress-induced phenomena in metallization is to assess the current understanding of the problems, to discuss the implications for the reliability of future devices. "Stress Induced Phenomena in Metallizations" IEEE Transaction of Device, Materials and Reliability 16 () 4 Book (Monography) 1.

Zschech "Bondkontakte. Metallphysikalische Prozesse in mikroelektronischen Drahtbondkontakten integrierter Schaltkreise" (. Stress Management for 3D ICS Using Through Silicon Vias:: International Workshop on Stress Management for 3D ICS Using Through Silicon Vias.

Get this from a library. Stress-induced phenomena in metallization: third international workshop, Palo Alto, CA June [P S Ho;]. Get this from a library. Stress-induced phenomena in metallization: eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden.

Proceedings of First International Workshop on Stress-Induced Phenomena in Metallization. "Held in the Sheraton Inn, Ithaca, New York on September"--Page vii.

"DOE CONF". Get this from a library. Stress-induced phenomena in metallization: Sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, July [Shefford P Baker;]. Okoro, C, Huyghebaert, C, Van Olmen, J, Labie, R, Lambrinou, K, Vandevelde, B, Beyne, E & Vandepitte, DElimination of The Axial Deformation Problem of Cu-TSV in 3D Integration.

in E Zschech, S Ogawa & PS Ho (eds), Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. vol Cited by: Stress induced mass transport (acoustomigration) is the dominant failure mechanism in surface acoustic wave (SAW) devices.

A strong microstructure damage of the metal finger electrodes by void and hillock formation results in an irreversible degradation of the electrical characteristics of the device.In: Stress-induced phenomena in metallization: Sixth international workshop on stress-induced phenomena in metallization, pp – Google Scholar An JH, Ferreira PJ () In situ transmission electron microscopy observations of μm and Cited by: 2.